Specifications
- 400 total tie-points:
- 300 general prototyping tie-points
- 2 columns of 30 rows of 5 interconnected tie-points
- 2 columns of 30 rows of 5 interconnected tie-points
- 100 power rail tie-points
- 2 pairs of positive and negative power rails, one pair on each side of the breadboard
- 25 interconnected tie-points per rail
- 25 interconnected tie-points per rail
- 2 pairs of positive and negative power rails, one pair on each side of the breadboard
- 300 general prototyping tie-points
- The two columns have a 0.3" (7.62mm) separation which allows for easy placement of
- DIP style package ICs
- Board-to-board side connectors on all four sides allow you to connect multiple breadboards together to form larger breadboards
- The power rail pairs are attached to the main board with the same board-to-board connectors
- You can remove the power rails from the main breadboard and cut the adhesive foam backing to make a smaller breadboard and independent power rail pairs
- You can remove the power rails from the main breadboard and cut the adhesive foam backing to make a smaller breadboard and independent power rail pairs
- The power rail pairs are attached to the main board with the same board-to-board connectors
- Peel away paper protected self-adhesive foam backing to mount to projects or mounting plates
- Hole Spacing: 2.54mm (0.1")
- Acceptable Pin Sizes: 29-21 AWG
- Contacts: 2.54mm (0.1")
- Material: Nickel plated brass
- Rated Amperage: 2A
- Dimensions (Excluding the board-to-board side connectors and adhesive foam backing):
- Length: 82.55mm (3.25")
- Width: 54.61mm (2.15")
- Height: 8.38mm (0.33")
- Length: 82.55mm (3.25")